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Sikabond 5500 S Solvent-based Parquet and Engineered Wood Floor Adhesive – Bulk Buy and Pallet Deals

Sika Pallet Deals and Bulk Buy

Sikabond 5500 S Solvent-based Parquet and Engineered Wood Floor Adhesive

Solvent Based Rigid Adhesive for Wood Block & Engineered Wood flooring

  • 1-part, ready to use.
  • High strength rigid bond.
  • Very good spreadability
  • Excellent adhesion to all types of wood.
  • Adhesive can be sanded.
  • Colour: beige
  • Packaging: 16Kg metal pails

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£94.88 +VAT

£94.88 +VAT
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Sikabond 5500 S extended information

Consumption: For full surface bonding only. Ensure that the contact faces of the wood elements are fully wetted with adhesive. 0.95 – 1.25 kg/m2 depending upon size of notched trowel used and subfloor surface profile. For the bonding of long or wide boards or in case of uneven substrates it could be necessary to use a notched trowel with bigger notches (avoid hollow sections).

Usage

For full surface bonding of:

  • Traditional parquet blocks and mosaic parquet, industrial parquet and end grained wood paving on cement, anhydrite, and poured asphalt sub-floors.
  • Can be used over underfloor heating installations.
  • Especially suited to wood block refurbishment projects where bitumen adhesive residues are present.

Product information

Chemical Base1 part synthetic resin combination
Packaging16 kg metal pails
Shelf Life12 months if stored as outlined, in undamaged original sealed container.
Storage ConditionsStore in dry conditions, and protect from direct sunlight, at temperatures not lower than +5 or higher than +25 °C
ColourBeige
Service Temperatureup to 35 °C

Sikabond 5500 S application information

ConsumptionFor full surface bonding only. Ensure that the contact faces of the wood elements are fully wetted with adhesive. 0.95 – 1.25 kg/m2 depending upon size of notched trowel used and subfloor surface profile.
For the bonding of long or wide boards or in case of uneven substrates it could be necessary to use a notched trowel with bigger notches (avoid hol- low sections).
Sag FlowConsistency: Spreads easily, trowel marks stable.
Ambient Air TemperatureRoom temperature above +10 °C, ideally +15 °C. Relative air humidity < 75 %.
For ambient temperatures the standard construction rules are relevant.
Relative Air HumidityBetween 40% and 75%
Substrate TemperatureDuring laying and until SikaBond®-5500 S has fully cured substrate temper- ature must be > + 10 °C and in the case of underfloor heating < + 20 °C.
For substrate temperatures the standard construction rules are relevant
Substrate Moisture ContentMaximum substrate moisture content :
▪ 2.5 % CM (carbide meter) for cement screed (ca. 4 % Tramex / Gravimet-
ric weight percent)
▪ 0.5 % CM for anhydrite screed
▪ 3 - 12 % CM for magnesia flooring (proportion of organic parts)
Maximum substrate moisture content in case of underfloor heating:
▪ 1.8 % CM for cement screed (ca. 3 % Tramex / Gravimetric weight per-
cent)
▪ 0.3 % CM for anhydrite screed
▪ 3 - 12 % CM for magnesia flooring (proportion of organic parts)
For moisture content and quality of substrates the guidelines of the wood floor manufacturer as well as standard construction rules must be ob- served.
Please Note: Most wood floor manufacturers state a maximum substrate moisture content of 2 % CM (ca.2.5 % Tramex).
Curing RateFloor may be walked on / sanded and finished approximately 48 - 72 hours after installation (depending on climatic conditions, absorbency of subfloor and adhesive layer thickness).
Skin Time / Laying Time~ 10 - 20 minutes (+23 °C / 50 % r.h.)

Limitations

  • SikaBond®-5500 S is only suitable for experienced applicators.
  • If, according to wood floor suppliers or producers deviation from the standards is permissible, temperatures between +10 °C and +35 °C must be observed for the adhesive.
  • Wood floors in non insulated areas such as basements, or other areas without a damp proof membrane, must only be installed after the application of Sikafloor® EpoCem sealed with Sika® Primer MB to control the moisture. For detailed instructions consult the Product Data Sheets or contact our Technical Department.
  • Do not use on PE, PP, TEFLON, and certain plasticised synthetic materials (carry out pre-trials or contact our Technical Department).
  • Some primers can negatively influence the adhesion of SikaBond®-5500 S (pre trials recommended).
  • When laying bonded wood flooring, always make sure that any wood surface sealer coatings do not come into contact with the adhesive. However if direct contact with the adhesive is unavoidable, then the compatibility of the sealing coats must always be checked and confirmed before use. For further information or assistance please contact Sika Technical Department.
  • Installation of magnesite or on insulating bituminous layers is not recommended.
  • The product and its vapours are highly inflammable, ensure adequate air ventilation during application and curing.
  • Keep away from flames and sparks and do not smoke around application area.

Application Instructions

SUBSTRATE PREPARATION

Substrate Quality: Clean and dry, homogeneous, even, free from grease, dust and loose particles. Paint, cement laitance and other poorly adhering particles must be removed. Standard construction rules must be observed.

Substrate Preparation:
Concrete / cement screed: Must be clean, dry, contaminant free and thoroughly cleaned with industrial vacuum cleaner.

Anhydrite screed / Anhydrite flowable screed: Must be ground and thoroughly cleaned with industrial vacuum cleaner.

Underfloor Heating: After thorough preparation and commissioning of the heating system, substrates with high moisture content should be primed using a mixture of 1 part SikaBond®-5500 S to 1 part Adhesive Thinner and Cleaner (by volume). Roller apply and allow to cure.
Unknown substrates: Please contact our Technical Department.
SikaBond®-5500 S can be used without priming on cement floors, poured asphalt and wooden floor panels providing they are dust free and permanently dry. Mastic ashphalt should be sanded and vacuumed.

Sikabond 5500 S APPLICATION METHOD / TOOLS

Full Surface Bonding. SikaBond 5500 S is only suitable for full surface bonding and should be applied to the subfloor NOT the wood elements.
SikaBond 5500 S should be applied to the properly prepared substrate directly from the pail and uniformly distributed by notched trowel. Press the wood floor elements firmly into the adhesive so that the underside is fully wetted. The elements can then be joined together using a hammer and an impact block. Many types of wood floors have to be tapped from the top. A distance of 10-15 mm from the wall to the wood floor must be observed in all cases.

Avoid getting adhesive on the side of the wood elements. Fresh, uncured adhesive remaining on the wood floor surface must be removed immediately with a clean cloth and if necessary cleaned with Adhesives Thinner & Cleaner. Test wood floor surfaces for compatibility with Adhesives Thinner & Cleaner before use.

The laying instructions of the wood floor manufacturer as well as standard construction rules must be observed.

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